3D-IC Design
Advanced 3D integration, chiplet architecture, die-to-die interfaces, and TSV design for next-gen packaging.
We Engineerthe Silicon thatPowers the Future.
End-to-end IC engineering services from architecture to silicon. Built for innovation. Optimized for performance. Delivered with precision.
CORE SERVICES
Our Expertise.
Full-stack semiconductor design capability, mapped the way our engineers actually think about a chip.
Silicon Photonics
Photonic IC design and integration services spanning waveguides, modulators, and electronic-photonic co-packaging for high-bandwidth optical interconnect.
RF & Analog
Transceivers, PLLs/synthesizers, and high-speed analog interfaces for 5G, Wi-Fi, automotive, and IoT applications.
TCAD Simulation
Process and device simulation, PDK calibration, and SPICE model extraction using Sentaurus TCAD and Silvaco Atlas/Victory.
Quantum Computing
Design and engineering support for quantum hardware — from cryo-CMOS control circuitry to qubit interconnect and packaging challenges unique to sub-Kelvin operation.
Physical Design
Full RTL-to-GDSII implementation — synthesis, floorplan, CTS, routing and signoff on nodes down to 3nm.
AMS Verification
Expert analog behavioral modeling and AMS verification for faster validation, shorter cycles, and higher design confidence.
UNDER THE FLOORPLAN
How Each Block Actually Gets Built.
The toolchains, nodes, and signoff criteria behind each service area.
ENGAGEMENT MODELS
Two Ways to Work With Us.
Flexible delivery structures, built around how chip projects actually run.
RETAINER-BASED
Dedicated team, monthly
- Allocation
- Senior engineers, assigned monthly
- Scope
- Task-driven — bugs, reviews, new features
- Billing
- Predictable monthly, easy to scale
- Best for
- Ongoing support & maintenance
TURNKEY
Fixed scope, spec to silicon
- Delivery
- Complete spec → GDSII / silicon
- Payments
- Milestone-based — spec, RTL, tapeout
- IP terms
- Work-for-hire — client owns all IP
- Best for
- New products & time-critical tapeouts
IP SECURITY
Your IP never
leaves the ODC.
Enterprise-grade protection at our Bangladesh offshore development center.
IP & Legal
- NDA signed by all personnel
- Work-for-hire — client owns IP
- Export regulation adherence
Device & Data
Access Control
Secure Communication
WHY BOSTON SEMICONDUCTOR
Built for chip teams that can't afford a leak.
FULL-STACK
One team, one partner
From TCAD device physics to physical verification signoff - no handoffs between vendors.
ADVANCED NODE
Proven on leading nodes
Tapeouts on TSMC 3nm–28nm, Samsung 5nm, and GlobalFoundries processes.
OUR LOCATIONS
Global Presence
ODC in Bangladesh with headquarters in USA.
IP-SAFE
Air-gapped delivery
Biometric ODC access and strict NDAs - your IP never leaves our secure environment.
COMMERCIAL
Flexible terms
Retainer or turnkey - we adapt to your project structure and budget.
TRACK RECORD
Silicon-validated
10+ tapeouts and proven analog IPs, recognized at BEAR 2025.
Blogs
Latest Insights.
CONTACT us